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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL090T-FG484

M2GL090T-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,882 162.96
M2GL090T-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090T-FGG484

M2GL090T-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,572 162.96
M2GL090T-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090-FG676

M2GL090-FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,216 163.39
M2GL090-FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090-FGG676

M2GL090-FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,364 163.39
M2GL090-FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M7A3P1000-2FGG256I

M7A3P1000-2FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,418 154.70
M7A3P1000-2FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M7A3P1000-2FG256I

M7A3P1000-2FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,050 154.70
M7A3P1000-2FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-FG256I

M1AFS250-FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,116 157.84
M1AFS250-FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-FGG256I

M1AFS250-FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,123 157.84
M1AFS250-FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS600-FGG484

M1AFS600-FGG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

2,344 159.14
M1AFS600-FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-FG484

M1AFS600-FG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

4,861 159.14
M1AFS600-FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A40MX02-3VQG80I

A40MX02-3VQG80I

IC FPGA 57 I/O 80VQFP

Microchip Technology

3,566 157.50
A40MX02-3VQG80I

数据手册

MX 80-TQFP Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 80-VQFP (14x14)
U1AFS250-FG256I

U1AFS250-FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,114 160.01
U1AFS250-FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
U1AFS250-FGG256I

U1AFS250-FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,412 160.01
U1AFS250-FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M7A3P1000-2PQG208I

M7A3P1000-2PQG208I

IC FPGA 154 I/O 208QFP

Microchip Technology

3,178 158.22
M7A3P1000-2PQG208I

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
AFS600-2FG256

AFS600-2FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,931 163.06
AFS600-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
AFS600-2FGG256

AFS600-2FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,109 163.06
AFS600-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
P1AFS600-2FGG256

P1AFS600-2FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,754 163.06
P1AFS600-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
P1AFS600-2FG256

P1AFS600-2FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,443 163.06
P1AFS600-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1AFS600-2FGG256

M1AFS600-2FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

3,955 163.06
M1AFS600-2FGG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1AFS600-2FG256

M1AFS600-2FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

4,445 163.06
M1AFS600-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)