产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX09-VQG100A

A42MX09-VQG100A

IC FPGA 83 I/O 100VQFP

Microchip Technology

4,685 169.10
A42MX09-VQG100A

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 100-VQFP (14x14)
A42MX09-2PLG84

A42MX09-2PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,514 166.78
A42MX09-2PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M2GL025TS-1FG484M

M2GL025TS-1FG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,149 177.46
M2GL025TS-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2GL025TS-1FGG484M

M2GL025TS-1FGG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,434 177.46
M2GL025TS-1FGG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 27696 1130496 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A42MX09-1PQG100I

A42MX09-1PQG100I

IC FPGA 83 I/O 100QFP

Microchip Technology

3,525 169.10
A42MX09-1PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)
M1A3PE1500-PQG208

M1A3PE1500-PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

1,698 168.91
M1A3PE1500-PQG208

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M1AFS250-1FG256I

M1AFS250-1FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,142 172.25
M1AFS250-1FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-1FGG256I

M1AFS250-1FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

4,365 172.25
M1AFS250-1FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS250-1FG256I

AFS250-1FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,397 172.25
AFS250-1FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS250-1FGG256I

AFS250-1FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,890 172.25
AFS250-1FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M7A3P1000-2FG484I

M7A3P1000-2FG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

1,259 169.18
M7A3P1000-2FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M7A3P1000-2FGG484I

M7A3P1000-2FGG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,628 169.18
M7A3P1000-2FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M2GL090T-FG676

M2GL090T-FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,361 179.74
M2GL090T-FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090T-FGG676

M2GL090T-FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

2,921 179.74
M2GL090T-FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
AX250-FG256

AX250-FG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,524 170.32
AX250-FG256

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
AX250-FGG256

AX250-FGG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

1,856 170.32
AX250-FGG256

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
AFS600-1FGG484

AFS600-1FGG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

1,703 173.57
AFS600-1FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-1FG484

M1AFS600-1FG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,580 173.57
M1AFS600-1FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-1FGG484

M1AFS600-1FGG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,794 173.57
M1AFS600-1FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
AFS600-1FG484

AFS600-1FG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,229 173.57
AFS600-1FG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)