产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX09-2PLG84I

A42MX09-2PLG84I

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,254 179.06
A42MX09-2PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A3P250-1VQ100M

A3P250-1VQ100M

IC FPGA 68 I/O 100VQFP

Microchip Technology

4,957 179.22
A3P250-1VQ100M

数据手册

ProASIC3 100-TQFP Tray Active Not Verified - - 36864 68 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 100-VQFP (14x14)
A3P250-1VQG100M

A3P250-1VQG100M

IC FPGA 68 I/O 100VQFP

Microchip Technology

3,617 179.22
A3P250-1VQG100M

数据手册

ProASIC3 100-TQFP Tray Active Not Verified - - 36864 68 250000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 100-VQFP (14x14)
M1A3PE1500-FGG484

M1A3PE1500-FGG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

3,126 180.83
M1A3PE1500-FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE1500-FGG484

A3PE1500-FGG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

1,042 180.83
A3PE1500-FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE1500-FG484

A3PE1500-FG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

2,834 180.83
A3PE1500-FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3PE1500-FG484

M1A3PE1500-FG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

2,046 180.83
M1A3PE1500-FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX16-1PLG84

A42MX16-1PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,727 181.70
A42MX16-1PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M2GL090-1FG484I

M2GL090-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,490 192.59
M2GL090-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C - - 484-FPBGA (23x23)
M2GL090-1FGG484I

M2GL090-1FGG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,464 192.59
M2GL090-1FGG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A42MX09-2PQG100I

A42MX09-2PQG100I

IC FPGA 83 I/O 100QFP

Microchip Technology

4,913 183.65
A42MX09-2PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)
M1AFS250-2FG256I

M1AFS250-2FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,150 186.69
M1AFS250-2FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS250-2FGG256I

AFS250-2FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,215 186.69
AFS250-2FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
AFS250-2FG256I

AFS250-2FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,625 186.69
AFS250-2FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-2FGG256I

M1AFS250-2FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

2,483 186.69
M1AFS250-2FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
A42MX16-PLG84I

A42MX16-PLG84I

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,541 183.42
A42MX16-PLG84I

数据手册

MX 84-LCC (J-Lead) Tube Last Time Buy Not Verified - - - 72 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
A3PE1500-1PQG208

A3PE1500-1PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

4,540 184.25
A3PE1500-1PQG208

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
M1A3PE1500-1PQG208

M1A3PE1500-1PQG208

IC FPGA 147 I/O 208QFP

Microchip Technology

4,729 184.25
M1A3PE1500-1PQG208

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 208-PQFP (28x28)
A54SX32A-1TQG100

A54SX32A-1TQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

1,937 185.40
A54SX32A-1TQG100

数据手册

SX-A 100-LQFP Tray Active Not Verified 2880 - - 81 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
M1AFS600-2FGG484

M1AFS600-2FGG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

1,613 188.21
M1AFS600-2FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)