| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM NXP USA Inc. |
1,740 | 6.52 |
|
数据手册 |
- | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS4503NAER2FS4500 NXP USA Inc. |
2,720 | 5.78 |
|
数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8435G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
3,025 | - |
|
数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33FS8435G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,817 | - |
|
数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC35FS6512NAEFS6500 NXP USA Inc. |
4,009 | 5.81 |
|
数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC35FS4507CAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
3,952 | - |
|
数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 NXP USA Inc. |
2,972 | 5.52 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 NXP USA Inc. |
2,005 | 5.52 |
|
- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
|
MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,111 | 7.55 |
|
数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
1,542 | 6.66 |
|
数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |