图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,374 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,245 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,104 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
3,784 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,610 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,699 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
2,666 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,231 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,160 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,107 | 6.66 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |