产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MPF5023AMBA0ES

MPF5023AMBA0ES

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

490 5.33

-

- 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 10µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 40-HVQFN (6x6)
MFS2401AVBA0ES

MFS2401AVBA0ES

MFS2401AVBA0ES

NXP USA Inc.

490 -
MFS2401AVBA0ES

数据手册

- 32-VFQFN Exposed Pad Bulk Active System Basis Chip - 5.5V ~ 40V -40°C ~ 115°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 32-HVQFN (5x5)
MFS2401AVBA1ES

MFS2401AVBA1ES

Safety Mini CAN FD SBC

NXP USA Inc.

135 -
MFS2401AVBA1ES

数据手册

- 32-VFQFN Exposed Pad Tray Active System Basis Chip - 5.5V ~ 40V -40°C ~ 115°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 32-HVQFN (5x5)
MC34PF1550A0EP

MC34PF1550A0EP

POWER MANAGEMENT IC 3 BUCK REGS

NXP USA Inc.

490 -

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A1EP

MC34PF1550A1EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.

490 2.72

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A2EP

MC34PF1550A2EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.

490 2.72

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MC34PF1550A3EP

MC34PF1550A3EP

POWER MANAGEMENT IC: 3 BUCK REGS

NXP USA Inc.

490 2.72

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 105°C - - Surface Mount 40-HVQFN (5x5)
MFS2320BMBA0EP

MFS2320BMBA0EP

MFS2320BMBA0EP

NXP USA Inc.

255 -
MFS2320BMBA0EP

数据手册

- 48-VFQFN Exposed Pad Tray Active System Basis Chip 30µA 5.5V ~ 40V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33FS4500NAE

MC33FS4500NAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

250 4.10
MC33FS4500NAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MPF5023CMBA0ES

MPF5023CMBA0ES

POWER MANAGEMENT IC, PRE-PROG, 3

NXP USA Inc.

490 -
MPF5023CMBA0ES

数据手册

- 40-VFQFN Exposed Pad Tray Active High Performance i.MX 8, S32x Processor Based 200µA 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)