图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33FS6500CAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
250 | 4.34 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MPF5024CMBA0ESPOWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
490 | - |
|
![]() 数据手册 |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MC33FS4500LAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
250 | 4.82 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4505CAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
240 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
![]() |
MC33FS6500LAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
250 | 4.59 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6505CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS6505NAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
250 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4505LAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
250 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6510LAESYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
250 | 4.69 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33PF3000A0ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
260 | 4.71 |
|
![]() 数据手册 |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |