产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC33910BAC

MC33910BAC

IC SYSTEM BASIS CHIP 32LQFP

NXP USA Inc.

1,673 1.94
MC33910BAC

数据手册

- 32-LQFP Tray Active System Basis Chip 4.5mA 5.5V ~ 27V -40°C ~ 125°C - - Surface Mount 32-LQFP (7x7)
MC32PF1550A5EP

MC32PF1550A5EP

PF1550

NXP USA Inc.

1,196 2.39

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C - - Surface Mount 40-HVQFN (5x5)
MC32PF1550A6EP

MC32PF1550A6EP

PF1550

NXP USA Inc.

1,063 2.54

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C - - Surface Mount 40-HVQFN (5x5)
MC32PF1550A7EP

MC32PF1550A7EP

PF1550

NXP USA Inc.

4,726 2.39

-

- 40-VFQFN Exposed Pad Tray Active Embedded Systems, Low-Power IoT, Mobile/Wearable Devices - 3.8V ~ 7V -40°C ~ 85°C - - Surface Mount 40-HVQFN (5x5)
MFS2300BMBA0EPR2

MFS2300BMBA0EPR2

MFS2300BMBA0EPR2

NXP USA Inc.

4,060 -
MFS2300BMBA0EPR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 40µA 5.5V ~ 40V -40°C ~ 125°C (TA) - - Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC32PF3001A7EPR2

MC32PF3001A7EPR2

IC PWR MGMT I.MX7 6LDO QFN 48

NXP USA Inc.

1,652 2.79
MC32PF3001A7EPR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Processor - 2.8V ~ 5.5V -40°C ~ 85°C - - Surface Mount 48-HVQFN (7x7)
MC32PF3001A6EPR2

MC32PF3001A6EPR2

POWER MANAGEMENT IC I.MX7 PRE-

NXP USA Inc.

1,151 2.59
MC32PF3001A6EPR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Processor - 2.8V ~ 5.5V -40°C ~ 85°C - - Surface Mount 48-HVQFN (7x7)
MFS2300BMMA0EP

MFS2300BMMA0EP

MFS2300BMMA0EP

NXP USA Inc.

3,801 -
MFS2300BMMA0EP

数据手册

- - Tape & Reel (TR) Active - - - - - - - -
MFS2401AVMA0ES

MFS2401AVMA0ES

MFS2401AVMA0ES

NXP USA Inc.

3,669 -
MFS2401AVMA0ES

数据手册

- 32-VFQFN Exposed Pad Bulk Active System Basis Chip - 5.5V ~ 40V -40°C ~ 115°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 32-HVQFN (5x5)
MFS5600AMBA0ESR2

MFS5600AMBA0ESR2

DUAL 36V AUTOMOTIVE DC-DC CONTRO

NXP USA Inc.

1,464 -
MFS5600AMBA0ESR2

数据手册

- 32-VFQFN Exposed Pad Tape & Reel (TR) Active - 140µA 2.7V ~ 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 32-HVQFN (5x5)