图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPF7100BVBA3ESPF7100 PMIC I.MX8DXP/DX NXP USA Inc. |
2,967 | 4.65 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA2ESPF7100 PMIC I.MX8XL NXP USA Inc. |
1,803 | 4.65 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA4ESPF7100 PMIC I.MX8DXP/DX NXP USA Inc. |
3,112 | 4.65 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33FS6502LAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
1,153 | 4.91 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6503NAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
3,427 | 4.91 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6526CAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
4,678 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 2.7V ~ 40V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC34PF1550A4EPR2POWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
1,811 | 2.59 |
|
![]() 数据手册 |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MC35FS4501NAER2FS4500 NXP USA Inc. |
1,229 | 4.92 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MFS8602BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
2,127 | 4.68 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MC33FS6512CAER2SYSTEM BASIS CHIP DCDC 1.5A VCO NXP USA Inc. |
2,235 | 4.94 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |