产品中心

制造商 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MC34PF8100EREPR2

MC34PF8100EREPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

4,065 5.73
MC34PF8100EREPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC34PF8100EQEPR2

MC34PF8100EQEPR2

POWER MANAGEMENT IC I.MX8 PRE-PR

NXP USA Inc.

3,494 5.73
MC34PF8100EQEPR2

数据手册

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC35FS4505CAE

MC35FS4505CAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

1,890 -
MC35FS4505CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6501NAER2

MC35FS6501NAER2

FS6500

NXP USA Inc.

3,474 5.02
MC35FS6501NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6506CAE

MC33FS6506CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

4,004 -
MC33FS6506CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS4502CAE

MC33FS4502CAE

SYSTEM BASIS CHIP LINEAR 0.5A V

NXP USA Inc.

2,563 5.03
MC33FS4502CAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC33FS6522NAE

MC33FS6522NAE

SYSTEM BASIS CHIP DCDC 2.2A VCO

NXP USA Inc.

3,805 5.03
MC33FS6522NAE

数据手册

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MFS2623AMBA0AD

MFS2623AMBA0AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

2,334 -
MFS2623AMBA0AD

数据手册

- 48-LQFP Exposed Pad Tray Active - - 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)
MFS2630AMDA0AD

MFS2630AMDA0AD

SAFETY SYSTEM BASIS CHIP WITH LO

NXP USA Inc.

3,258 -
MFS2630AMDA0AD

数据手册

- 48-LQFP Exposed Pad Tray Active - 29µA 3.2V ~ 40V -40°C ~ 125°C (TA) Automotive - Surface Mount 48-LQFP-EP (7x7)
MC33FS6527CAER2

MC33FS6527CAER2

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

4,286 -
MC33FS6527CAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)