图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC34PF8100EREPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
4,065 | 5.73 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC34PF8100EQEPR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
3,494 | 5.73 |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC35FS4505CAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
1,890 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS6501NAER2FS6500 NXP USA Inc. |
3,474 | 5.02 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6506CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
4,004 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4502CAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
2,563 | 5.03 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6522NAESYSTEM BASIS CHIP DCDC 2.2A VCO NXP USA Inc. |
3,805 | 5.03 |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MFS2623AMBA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
2,334 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MFS2630AMDA0ADSAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
3,258 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | - | 29µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MC33FS6527CAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
4,286 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |