图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC35FS4506NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
2,143 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS8415GJKSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,455 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8415GYKSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
4,246 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8415GYESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
4,866 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8415G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,593 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8415G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
1,366 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8415GJESR2SAFETY POWER MANAGEMENT IC, QFN5 NXP USA Inc. |
2,052 | - |
|
![]() 数据手册 |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS6507CAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
1,162 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6527LAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
2,654 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6528NAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
4,787 | - |
|
![]() 数据手册 |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |