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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL060-FG484

M2GL060-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,768 87.52
M2GL060-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL060-FGG484

M2GL060-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,416 87.52
M2GL060-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A40MX02-2PLG68I

A40MX02-2PLG68I

IC FPGA 57 I/O 68PLCC

Microchip Technology

4,335 83.22
A40MX02-2PLG68I

数据手册

MX 68-LCC (J-Lead) Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 68-PLCC (24.23x24.23)
A40MX04-1PLG84

A40MX04-1PLG84

IC FPGA 69 I/O 84PLCC

Microchip Technology

1,986 83.52
A40MX04-1PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 69 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
A40MX02-2PQG100

A40MX02-2PQG100

IC FPGA 57 I/O 100QFP

Microchip Technology

1,707 83.52
A40MX02-2PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 57 3000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
M1AGL600V5-FG144I

M1AGL600V5-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,215 84.30
M1AGL600V5-FG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
M1AGL600V5-FGG144I

M1AGL600V5-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,116 84.30
M1AGL600V5-FGG144I

数据手册

IGLOO 144-LBGA Tray Active Not Verified - 13824 110592 97 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 144-FPBGA (13x13)
A3P1000-2FGG256

A3P1000-2FGG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,936 83.43
A3P1000-2FGG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
A3P1000-2FG256

A3P1000-2FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,333 83.43
A3P1000-2FG256

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M1A3P1000-2FG256

M1A3P1000-2FG256

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,858 83.43

-

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)