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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL050TS-1FCSG325

M2GL050TS-1FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

2,155 93.69
M2GL050TS-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL050TS-FCS325I

M2GL050TS-FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

3,406 93.69
M2GL050TS-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL050TS-FCSG325I

M2GL050TS-FCSG325I

IC FPGA 200 I/O 324CSBGA

Microchip Technology

1,566 93.69
M2GL050TS-FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56340 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060T-1FCS325I

M2GL060T-1FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

4,611 93.69
M2GL060T-1FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060T-1FCSG325I

M2GL060T-1FCSG325I

IC FPGA 200 I/O 324CSBGA

Microchip Technology

1,357 93.69
M2GL060T-1FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060TS-1FCS325

M2GL060TS-1FCS325

IC FPGA 200 I/O 325BGA

Microchip Technology

3,955 93.69
M2GL060TS-1FCS325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060TS-1FCSG325

M2GL060TS-1FCSG325

IC FPGA 200 I/O 324CSBGA

Microchip Technology

2,703 93.69
M2GL060TS-1FCSG325

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 325-FCBGA (11x11)
M2GL060TS-FCS325I

M2GL060TS-FCS325I

IC FPGA 200 I/O 325BGA

Microchip Technology

4,652 93.69
M2GL060TS-FCS325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M2GL060TS-FCSG325I

M2GL060TS-FCSG325I

IC FPGA 200 I/O 324CSBGA

Microchip Technology

2,149 93.69
M2GL060TS-FCSG325I

数据手册

IGLOO2 325-TFBGA, FCBGA Tray Active Not Verified - 56520 1869824 200 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 325-FCBGA (11x11)
M1A3P1000L-FGG144

M1A3P1000L-FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,790 86.09
M1A3P1000L-FGG144

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)