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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A40MX04-3PLG44

A40MX04-3PLG44

IC FPGA 34 I/O 44PLCC

Microchip Technology

3,847 121.68
A40MX04-3PLG44

数据手册

MX 44-LCC (J-Lead) Tray Active Not Verified - - - 34 6000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 44-PLCC (16.59x16.59)
M2GL060T-1FG676I

M2GL060T-1FG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

3,548 128.69
M2GL060T-1FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL060T-1FGG676I

M2GL060T-1FGG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,066 128.69
M2GL060T-1FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-1FG676

M2GL060TS-1FG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,684 128.69
M2GL060TS-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-1FGG676

M2GL060TS-1FGG676

IC FPGA 387 I/O 676FBGA

Microchip Technology

2,222 128.69
M2GL060TS-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-FG676I

M2GL060TS-FG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,058 128.69
M2GL060TS-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL060TS-FGG676I

M2GL060TS-FGG676I

IC FPGA 387 I/O 676FBGA

Microchip Technology

4,625 128.69
M2GL060TS-FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 56520 1869824 387 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M7A3P1000-1FG144

M7A3P1000-1FG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

3,422 121.69
M7A3P1000-1FG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M7A3P1000-1FGG144

M7A3P1000-1FGG144

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,740 121.69
M7A3P1000-1FGG144

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 144-FPBGA (13x13)
M2GL050TS-1FG484I

M2GL050TS-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,435 129.18
M2GL050TS-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)