产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AFS600-2FG256

M1AFS600-2FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

4,445 163.06
M1AFS600-2FG256

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 256-FPBGA (17x17)
M2GL090-1FG484

M2GL090-1FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

4,470 170.37
M2GL090-1FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090-1FGG484

M2GL090-1FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,270 170.37
M2GL090-1FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX24-FPLG84

A42MX24-FPLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

1,595 161.46
A42MX24-FPLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M7A3P1000-1FG484I

M7A3P1000-1FG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

2,331 160.78
M7A3P1000-1FG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M7A3P1000-1FGG484I

M7A3P1000-1FGG484I

IC FPGA 300 I/O 484FBGA

Microchip Technology

1,869 160.78
M7A3P1000-1FGG484I

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3P1000L-FGG144I

M1A3P1000L-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,245 161.11
M1A3P1000L-FGG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A3P1000L-FGG144I

A3P1000L-FGG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,991 161.11
A3P1000L-FGG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000L-FG144I

M1A3P1000L-FG144I

IC FPGA 97 I/O 144FBGA

Microchip Technology

1,218 161.11
M1A3P1000L-FG144I

数据手册

ProASIC3L 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.14V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 144-FPBGA (13x13)
A42MX09-1VQG100I

A42MX09-1VQG100I

IC FPGA 83 I/O 100VQFP

Microchip Technology

3,746 162.46
A42MX09-1VQG100I

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-VQFP (14x14)