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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX16-PLG84

A42MX16-PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

2,025 153.29
A42MX16-PLG84

数据手册

MX 84-LCC (J-Lead) Tube Active Verified - - - 72 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
M2GL090T-FG484

M2GL090T-FG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,882 162.96
M2GL090T-FG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090T-FGG484

M2GL090T-FGG484

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,572 162.96
M2GL090T-FGG484

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M2GL090-FG676

M2GL090-FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,216 163.39
M2GL090-FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090-FGG676

M2GL090-FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,364 163.39
M2GL090-FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M7A3P1000-2FGG256I

M7A3P1000-2FGG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

1,418 154.70
M7A3P1000-2FGG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M7A3P1000-2FG256I

M7A3P1000-2FG256I

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,050 154.70
M7A3P1000-2FG256I

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-FG256I

M1AFS250-FG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

3,116 157.84
M1AFS250-FG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS250-FGG256I

M1AFS250-FGG256I

IC FPGA 114 I/O 256FBGA

Microchip Technology

1,123 157.84
M1AFS250-FGG256I

数据手册

Fusion® 256-LBGA Tray Active Not Verified - - 36864 114 250000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 256-FPBGA (17x17)
M1AFS600-FGG484

M1AFS600-FGG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

2,344 159.14
M1AFS600-FGG484

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)