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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL150-FCG1152

M2GL150-FCG1152

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

3,567 259.02
M2GL150-FCG1152

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2GL150-FC1152

M2GL150-FC1152

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

1,941 259.02
M2GL150-FC1152

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
A42MX16-3PQG160

A42MX16-3PQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

2,609 262.06
A42MX16-3PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
A42MX16-2PQG160I

A42MX16-2PQG160I

IC FPGA 125 I/O 160QFP

Microchip Technology

3,390 262.06
A42MX16-2PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
A3PE1500-2FG676I

A3PE1500-2FG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

1,455 262.99
A3PE1500-2FG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-2FG676I

M1A3PE1500-2FG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

1,900 262.99
M1A3PE1500-2FG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-2FGG676I

M1A3PE1500-2FGG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

4,138 262.99
M1A3PE1500-2FGG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
A42MX16-3VQG100I

A42MX16-3VQG100I

IC FPGA 83 I/O 100VQFP

Microchip Technology

1,988 264.59
A42MX16-3VQG100I

数据手册

MX 100-TQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-VQFP (14x14)
A42MX16-TQG176A

A42MX16-TQG176A

IC FPGA 140 I/O 176TQFP

Microchip Technology

4,527 268.54
A42MX16-TQG176A

数据手册

MX 176-LQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 176-TQFP (24x24)
A54SX72A-FFGG256

A54SX72A-FFGG256

IC FPGA 203 I/O 256FBGA

Microchip Technology

2,901 265.15
A54SX72A-FFGG256

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)