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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX16-1TQG176I

A42MX16-1TQG176I

IC FPGA 140 I/O 176TQFP

Microchip Technology

3,568 256.60
A42MX16-1TQG176I

数据手册

MX 176-LQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
M2GL060TS-1FG484M

M2GL060TS-1FG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,019 271.27
M2GL060TS-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2GL060TS-1FGG484M

M2GL060TS-1FGG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

3,388 271.27
M2GL060TS-1FGG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56520 1869824 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3P1000-FG484M

A3P1000-FG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology

2,885 255.62
A3P1000-FG484M

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3P1000-FGG484M

A3P1000-FGG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,260 255.62
A3P1000-FGG484M

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3P1000-1FG256M

A3P1000-1FG256M

IC FPGA 177 I/O 256FBGA

Microchip Technology

2,881 256.03
A3P1000-1FG256M

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
A3P1000-1FGG256M

A3P1000-1FGG256M

IC FPGA 177 I/O 256FBGA

Microchip Technology

4,240 256.03
A3P1000-1FGG256M

数据手册

ProASIC3 256-LBGA Tray Active Not Verified - - 147456 177 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 256-FPBGA (17x17)
M2GL150-1FCV484

M2GL150-1FCV484

IC FPGA 248 I/O 484BGA

Microchip Technology

3,560 271.77
M2GL150-1FCV484

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
M2GL150-1FCVG484

M2GL150-1FCVG484

IC FPGA 248 I/O 484BGA

Microchip Technology

4,080 271.77
M2GL150-1FCVG484

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-BGA
M2GL150-FCV484I

M2GL150-FCV484I

IC FPGA 248 I/O 484BGA

Microchip Technology

4,722 271.77
M2GL150-FCV484I

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)