产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX72A-FFG256

A54SX72A-FFG256

IC FPGA 203 I/O 256FBGA

Microchip Technology

2,154 265.15
A54SX72A-FFG256

数据手册

SX-A 256-BGA Tray Active Not Verified 6036 - - 203 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A54SX32A-1BGG329

A54SX32A-1BGG329

IC FPGA 249 I/O 329BGA

Microchip Technology

1,068 265.15
A54SX32A-1BGG329

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32A-1BG329

A54SX32A-1BG329

IC FPGA 249 I/O 329BGA

Microchip Technology

1,879 265.15
A54SX32A-1BG329

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32A-BGG329I

A54SX32A-BGG329I

IC FPGA 249 I/O 329BGA

Microchip Technology

1,193 265.15
A54SX32A-BGG329I

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 329-PBGA (31x31)
A42MX16-2PQG208I

A42MX16-2PQG208I

IC FPGA 140 I/O 208QFP

Microchip Technology

3,326 264.08
A42MX16-2PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
M1A3P1000-1PQG208M

M1A3P1000-1PQG208M

IC FPGA 154 I/O 208QFP

Microchip Technology

2,160 266.30
M1A3P1000-1PQG208M

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 208-PQFP (28x28)
A3P1000-1PQG208M

A3P1000-1PQG208M

IC FPGA 154 I/O 208QFP

Microchip Technology

4,859 266.30
A3P1000-1PQG208M

数据手册

ProASIC3 208-BFQFP Tray Active Not Verified - - 147456 154 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 208-PQFP (28x28)
A54SX32A-2TQG144I

A54SX32A-2TQG144I

IC FPGA 113 I/O 144TQFP

Microchip Technology

4,817 267.60
A54SX32A-2TQG144I

数据手册

SX-A 144-LQFP Tray Active Not Verified 2880 - - 113 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 144-TQFP (20x20)
APA300-FGG256I

APA300-FGG256I

IC FPGA 186 I/O 256FBGA

Microchip Technology

3,336 273.86
APA300-FGG256I

数据手册

ProASICPLUS 256-LBGA Tray Active Not Verified - - 73728 186 300000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A42MX09-3TQG176I

A42MX09-3TQG176I

IC FPGA 104 I/O 176TQFP

Microchip Technology

3,312 271.22
A42MX09-3TQG176I

数据手册

MX 176-LQFP Tray Active Not Verified - - - 104 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)