| 图片 | 制造商型号 | 库存情况 | 价格 | 库存 | 数据手册 | 系列 | 封装/外壳 | 包装 | 产品状态 | 应用 | 电流 - 电源 | 电压 - 电源 | 工作温度 | 等级 | 认证 | 安装类型 | 供应商设备封装 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC32PF3001A2EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
1,483 | 0.80 |
|
数据手册 |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF3001A4EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,458 | 0.80 |
|
数据手册 |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MC32PF3001A5EPPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,840 | 0.80 |
|
数据手册 |
- | 48-VFQFN Exposed Pad | Tray | Active | Processor | - | 2.8V ~ 5.5V | -40°C ~ 85°C | - | - | Surface Mount | 48-HVQFN (7x7) |
|
MFS2325BMBA0EPMFS2325BMBA0EP NXP USA Inc. |
2,239 | - |
|
数据手册 |
- | 48-VFQFN Exposed Pad | Bulk | Active | System Basis Chip | - | 3.3V, 5V | -40°C ~ 120°C | - | - | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
|
MPF5024AMMA0ESR2POWER MANAGEMENT IC, PRE-PROG, 4 NXP USA Inc. |
2,956 | 3.29 |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5024AVNA0ESR2PF5024 NXP USA Inc. |
1,779 | 3.29 |
|
- |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | - | - | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5032BMMA0ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
3,027 | - |
|
数据手册 |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5032BMMA5ESR2PMIC 2 BUCKS 2 LDO A1 DIE NXP USA Inc. |
4,796 | - |
|
数据手册 |
- | 40-PowerVFQFN | Tape & Reel (TR) | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CVNA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
3,918 | - |
|
数据手册 |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
|
MPF5023CMMA0ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
4,216 | - |
|
数据手册 |
- | 40-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | 200µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |