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全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 应用 电流 - 电源 电压 - 电源 工作温度 等级 认证 安装类型 供应商设备封装
MPF5030BMMA4ESR2

MPF5030BMMA4ESR2

PMIC 3 BUCKS 2 LDO A1 DIE

NXP USA Inc.

3,749 -
MPF5030BMMA4ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5030BMMA0ESR2

MPF5030BMMA0ESR2

PMIC 3 BUCKS 2 LDO A1 DIE

NXP USA Inc.

2,749 -
MPF5030BMMA0ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MFS8620BMDA0ESR2

MFS8620BMDA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

1,501 -
MFS8620BMDA0ESR2

数据手册

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 36V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33FS6500NAER2

MC33FS6500NAER2

SYSTEM BASIS CHIP DCDC 0.8A VCO

NXP USA Inc.

2,258 3.61
MC33FS6500NAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MPF5032BMDA0ESR2

MPF5032BMDA0ESR2

PMIC 2 BUCKS 2 LDO

NXP USA Inc.

4,935 -
MPF5032BMDA0ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MC33FS6505KAER2

MC33FS6505KAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

1,059 -
MC33FS6505KAER2

数据手册

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MWSP10C1AVLC

MWSP10C1AVLC

AUTOQI WIRELESS CHARGING

NXP USA Inc.

1,491 -

-

- - Tray Active - - - - - - - -
MPF5024CMMA0ESR2

MPF5024CMMA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 4

NXP USA Inc.

3,281 -
MPF5024CMMA0ESR2

数据手册

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5024CVNA0ESR2

MPF5024CVNA0ESR2

POWER MANAGEMENT IC, PRE-PROG, 4

NXP USA Inc.

2,929 -
MPF5024CVNA0ESR2

数据手册

- 40-VFQFN Exposed Pad Tape & Reel (TR) Active High Performance i.MX 8 Processor Based - 2.5V ~ 5.5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)
MPF5030BMBA0ESR2

MPF5030BMBA0ESR2

PMIC 3 BUCKS 2 LDO A1 DIE

NXP USA Inc.

1,748 -
MPF5030BMBA0ESR2

数据手册

- 40-PowerVFQFN Tape & Reel (TR) Active System Basis Chip - 3.3V ~ 5.25V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 40-HVQFN (6x6)