产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A42MX09-3PQG100I

A42MX09-3PQG100I

IC FPGA 83 I/O 100QFP

Microchip Technology

1,304 208.22
A42MX09-3PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)
M1A3PE1500-FG484I

M1A3PE1500-FG484I

IC FPGA 280 I/O 484FBGA

Microchip Technology

3,426 207.97
M1A3PE1500-FG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1A3PE1500-FGG484I

M1A3PE1500-FGG484I

IC FPGA 280 I/O 484FBGA

Microchip Technology

2,413 207.97
M1A3PE1500-FGG484I

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A42MX16-1PQG160

A42MX16-1PQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

2,938 209.89
A42MX16-1PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
A42MX16-1PLG84I

A42MX16-1PLG84I

IC FPGA 72 I/O 84PLCC

Microchip Technology

1,476 210.54
A42MX16-1PLG84I

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 84-PLCC (29.31x29.31)
M1A3PE1500-1FGG676

M1A3PE1500-1FGG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

1,316 211.14
M1A3PE1500-1FGG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-1FG676

M1A3PE1500-1FG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

1,102 211.14
M1A3PE1500-1FG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
A3PE1500-1FG676

A3PE1500-1FG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

4,563 211.14
A3PE1500-1FG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
A3PE1500-1FGG676

A3PE1500-1FGG676

IC FPGA 444 I/O 676FBGA

Microchip Technology

2,512 211.14
A3PE1500-1FGG676

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
A54SX16-TQG176

A54SX16-TQG176

IC FPGA 147 I/O 176TQFP

Microchip Technology

1,868 212.68
A54SX16-TQG176

数据手册

SX 176-LQFP Tray Active Not Verified 1452 - - 147 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)