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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A3PE1500-2FGG484

A3PE1500-2FGG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

3,284 213.70
A3PE1500-2FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A42MX16-PLG84A

A42MX16-PLG84A

IC FPGA 72 I/O 84PLCC

Microchip Technology

4,206 218.15
A42MX16-PLG84A

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 125°C (TA) - - 84-PLCC (29.31x29.31)
A54SX32A-TQG144A

A54SX32A-TQG144A

IC FPGA 113 I/O 144TQFP

Microchip Technology

1,286 218.62
A54SX32A-TQG144A

数据手册

SX-A 144-LQFP Tray Active Not Verified 2880 - - 113 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 125°C (TA) - - 144-TQFP (20x20)
M2GL090T-1FGG676I

M2GL090T-1FGG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,451 228.74
M2GL090T-1FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86316 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-1FG676

M2GL090TS-1FG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,378 228.74
M2GL090TS-1FG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-1FGG676

M2GL090TS-1FGG676

IC FPGA 425 I/O 676FBGA

Microchip Technology

4,534 228.74
M2GL090TS-1FGG676

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-FG676I

M2GL090TS-FG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,539 228.74
M2GL090TS-FG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-FGG676I

M2GL090TS-FGG676I

IC FPGA 425 I/O 676FBGA

Microchip Technology

1,092 228.74
M2GL090TS-FGG676I

数据手册

IGLOO2 676-BGA Tray Active Not Verified - 86184 2648064 425 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL090TS-1FG484I

M2GL090TS-1FG484I

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,940 229.62
M2GL090TS-1FG484I

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 86316 2648064 267 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A42MX16-1PQG208

A42MX16-1PQG208

IC FPGA 140 I/O 208QFP

Microchip Technology

2,171 216.58
A42MX16-1PQG208

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)