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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1A3PE1500-1PQG208I

M1A3PE1500-1PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

4,807 211.87
M1A3PE1500-1PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
A3PE1500-1PQG208I

A3PE1500-1PQG208I

IC FPGA 147 I/O 208QFP

Microchip Technology

1,431 211.87
A3PE1500-1PQG208I

数据手册

ProASIC3E 208-BFQFP Tray Active Not Verified - - 276480 147 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 208-PQFP (28x28)
M7AFS600-1FG256

M7AFS600-1FG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,372 215.98

-

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
M7AFS600-1FGG256

M7AFS600-1FGG256

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,661 215.98

-

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
A54SX32A-1TQG100I

A54SX32A-1TQG100I

IC FPGA 81 I/O 100TQFP

Microchip Technology

2,284 214.39
A54SX32A-1TQG100I

数据手册

SX-A 100-LQFP Tray Active Not Verified 2880 - - 81 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 100-TQFP (14x14)
A54SX32A-2TQG100

A54SX32A-2TQG100

IC FPGA 81 I/O 100TQFP

Microchip Technology

3,374 214.39
A54SX32A-2TQG100

数据手册

SX-A 100-LQFP Tray Active Not Verified 2880 - - 81 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-TQFP (14x14)
A54SX32A-1PQG208

A54SX32A-1PQG208

IC FPGA 174 I/O 208QFP

Microchip Technology

2,057 213.62
A54SX32A-1PQG208

数据手册

SX-A 208-BFQFP Tray Active Not Verified 2880 - - 174 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
M1A3PE1500-2FGG484

M1A3PE1500-2FGG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

3,905 213.70
M1A3PE1500-2FGG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
M1A3PE1500-2FG484

M1A3PE1500-2FG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

4,357 213.70
M1A3PE1500-2FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)
A3PE1500-2FG484

A3PE1500-2FG484

IC FPGA 280 I/O 484FBGA

Microchip Technology

1,071 213.70
A3PE1500-2FG484

数据手册

ProASIC3E 484-BGA Tray Active Not Verified - - 276480 280 1500000 1.425V ~ 1.575V Surface Mount 0°C ~ 85°C (TJ) - - 484-FPBGA (23x23)