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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M7AFS600-FG484

M7AFS600-FG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,313 224.70

-

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
M7AFS600-FGG484

M7AFS600-FGG484

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,854 224.70

-

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
M1A3PE1500-FGG676I

M1A3PE1500-FGG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

2,936 222.46
M1A3PE1500-FGG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M1A3PE1500-FG676I

M1A3PE1500-FG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

4,826 222.46
M1A3PE1500-FG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
A3PE1500-FGG676I

A3PE1500-FGG676I

IC FPGA 444 I/O 676FBGA

Microchip Technology

2,323 222.46
A3PE1500-FGG676I

数据手册

ProASIC3E 676-BGA Tray Active Not Verified - - 276480 444 1500000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 676-FBGA (27x27)
M2GL150-FCV484

M2GL150-FCV484

IC FPGA 248 I/O 484BGA

Microchip Technology

4,709 236.33
M2GL150-FCV484

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
M2GL150-FCVG484

M2GL150-FCVG484

IC FPGA 248 I/O 484BGA

Microchip Technology

2,138 236.33
M2GL150-FCVG484

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-BGA
A42MX16-2PQG100

A42MX16-2PQG100

IC FPGA 83 I/O 100QFP

Microchip Technology

3,566 223.77
A42MX16-2PQG100

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 100-PQFP (20x14)
A42MX16-1TQG176

A42MX16-1TQG176

IC FPGA 140 I/O 176TQFP

Microchip Technology

2,416 223.77
A42MX16-1TQG176

数据手册

MX 176-LQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)
A42MX09-2TQG176

A42MX09-2TQG176

IC FPGA 104 I/O 176TQFP

Microchip Technology

4,382 223.77
A42MX09-2TQG176

数据手册

MX 176-LQFP Tray Active Not Verified - - - 104 14000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)