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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX16P-TQG176

A54SX16P-TQG176

IC FPGA 147 I/O 176TQFP

Microchip Technology

4,746 218.23
A54SX16P-TQG176

数据手册

SX 176-LQFP Tray Active Not Verified 1452 - - 147 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 176-TQFP (24x24)
M1A3P1000-FG144M

M1A3P1000-FG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,381 217.55
M1A3P1000-FG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
M1A3P1000-FGG144M

M1A3P1000-FGG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

2,550 217.55
M1A3P1000-FGG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
A3P1000-FGG144M

A3P1000-FGG144M

IC FPGA 97 I/O 144FBGA

Microchip Technology

4,606 217.55
A3P1000-FGG144M

数据手册

ProASIC3 144-LBGA Tray Active Not Verified - - 147456 97 1000000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
A42MX16-1PQG100I

A42MX16-1PQG100I

IC FPGA 83 I/O 100QFP

Microchip Technology

4,669 220.14
A42MX16-1PQG100I

数据手册

MX 100-BQFP Tray Active Not Verified - - - 83 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 100-PQFP (20x14)
M2GL050T-1FG484M

M2GL050T-1FG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

2,863 233.34
M2GL050T-1FG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2GL050T-1FGG484M

M2GL050T-1FGG484M

IC FPGA 267 I/O 484FBGA

Microchip Technology

1,508 233.34
M2GL050T-1FGG484M

数据手册

IGLOO2 484-BGA Tray Active Not Verified - 56340 1869824 267 - 1.14V ~ 2.625V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A42MX09-2PQG160I

A42MX09-2PQG160I

IC FPGA 101 I/O 160QFP

Microchip Technology

2,350 220.22
A42MX09-2PQG160I

数据手册

MX 160-BQFP Tray Active Not Verified - - - 101 14000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 160-PQFP (28x28)
AX250-1FG256

AX250-1FG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

2,024 221.30
AX250-1FG256

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)
AX250-1FGG256

AX250-1FGG256

IC FPGA 138 I/O 256FBGA

Microchip Technology

2,073 221.30
AX250-1FGG256

数据手册

Axcelerator 256-LBGA Tray Active Not Verified 4224 - 55296 138 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 256-FPBGA (17x17)