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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M2GL150T-FCG1152

M2GL150T-FCG1152

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

3,065 284.91
M2GL150T-FCG1152

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
MPF200T-1FCG784E

MPF200T-1FCG784E

IC FPGA 364 I/O 784FCBGA

Microchip Technology

1,869 325.11
MPF200T-1FCG784E

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 192000 13619200 364 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF200TL-FCG784E

MPF200TL-FCG784E

IC FPGA 364 I/O 784FCBGA

Microchip Technology

1,760 325.11
MPF200TL-FCG784E

数据手册

PolarFire™ 784-BBGA, FCBGA Tray Active Not Verified - 192000 13619200 364 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 784-FCBGA (29x29)
MPF100TLS-FCVG484I

MPF100TLS-FCVG484I

IC FPGA 284 I/O 484FBGA

Microchip Technology

4,457 301.98
MPF100TLS-FCVG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 109000 7782400 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
MPF100TS-1FCVG484I

MPF100TS-1FCVG484I

IC FPGA 284 I/O 484FCBGA

Microchip Technology

3,577 301.98
MPF100TS-1FCVG484I

数据手册

PolarFire™ 484-BBGA, FCBGA Tray Active Not Verified - 109000 7782400 284 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FCBGA (23x23)
APA300-FGG144A

APA300-FGG144A

IC FPGA 100 I/O 144FBGA

Microchip Technology

1,894 298.08
APA300-FGG144A

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 73728 100 300000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
APA300-FG144A

APA300-FG144A

IC FPGA 100 I/O 144FBGA

Microchip Technology

3,410 298.08
APA300-FG144A

数据手册

ProASICPLUS 144-LBGA Tray Active Not Verified - - 73728 100 300000 2.375V ~ 2.625V Surface Mount -40°C ~ 125°C (TJ) - - 144-FPBGA (13x13)
M2GL150-1FCV484I

M2GL150-1FCV484I

IC FPGA 248 I/O 484BGA

Microchip Technology

1,113 307.22
M2GL150-1FCV484I

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
M2GL150-1FCVG484I

M2GL150-1FCVG484I

IC FPGA 248 I/O 484BGA

Microchip Technology

4,306 307.22
M2GL150-1FCVG484I

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-BGA
A54SX16P-PQG208I

A54SX16P-PQG208I

IC FPGA 175 I/O 208QFP

Microchip Technology

4,046 290.54
A54SX16P-PQG208I

数据手册

SX 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)