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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX16P-1PQG208

A54SX16P-1PQG208

IC FPGA 175 I/O 208QFP

Microchip Technology

3,654 290.54
A54SX16P-1PQG208

数据手册

SX 208-BFQFP Tray Active Not Verified 1452 - - 175 24000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
M2GL150-1FCS536

M2GL150-1FCS536

IC FPGA 293 I/O 536CSPBGA

Microchip Technology

3,555 309.21
M2GL150-1FCS536

数据手册

IGLOO2 536-LFBGA, CSPBGA Tray Active Not Verified - 146124 5120000 293 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
M2GL150-1FCSG536

M2GL150-1FCSG536

IC FPGA 293 I/O 536CSPBGA

Microchip Technology

1,892 309.21
M2GL150-1FCSG536

数据手册

IGLOO2 536-LFBGA, CSPBGA Tray Active Not Verified - 146124 5120000 293 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 536-CSPBGA (16x16)
M2GL150-FCS536I

M2GL150-FCS536I

IC FPGA 293 I/O 536CSPBGA

Microchip Technology

1,424 309.21
M2GL150-FCS536I

数据手册

IGLOO2 536-LFBGA, CSPBGA Tray Active Not Verified - 146124 5120000 293 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
M2GL150-FCSG536I

M2GL150-FCSG536I

IC FPGA 293 I/O 536CSPBGA

Microchip Technology

2,917 309.21
M2GL150-FCSG536I

数据手册

IGLOO2 536-LFBGA, CSPBGA Tray Active Not Verified - 146124 5120000 293 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 536-CSPBGA (16x16)
AX500-2PQG208

AX500-2PQG208

IC FPGA 115 I/O 208QFP

Microchip Technology

3,106 291.71
AX500-2PQG208

数据手册

Axcelerator 208-BFQFP Tray Active Not Verified 8064 - 73728 115 500000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 208-PQFP (28x28)
APA300-BGG456I

APA300-BGG456I

IC FPGA 290 I/O 456BGA

Microchip Technology

2,533 298.72
APA300-BGG456I

数据手册

ProASICPLUS 456-BBGA Tray Active Not Verified - - 73728 290 300000 2.3V ~ 2.7V Surface Mount -40°C ~ 85°C (TA) - - 456-PBGA (35x35)
A42MX24-1PLG84

A42MX24-1PLG84

IC FPGA 72 I/O 84PLCC

Microchip Technology

1,750 294.21
A42MX24-1PLG84

数据手册

MX 84-LCC (J-Lead) Tray Last Time Buy Not Verified - - - 72 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 84-PLCC (29.31x29.31)
MPF200T-1FCVG484E

MPF200T-1FCVG484E

IC FPGA 284 I/O 484FBGA

Microchip Technology

3,741 336.49
MPF200T-1FCVG484E

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
MPF200TL-FCVG484E

MPF200TL-FCVG484E

IC FPGA 284 I/O 484FBGA

Microchip Technology

3,712 336.49
MPF200TL-FCVG484E

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 284 - 0.97V ~ 1.08V Surface Mount 0°C ~ 100°C (TJ) - - 484-FPBGA (19x19)