产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
MPF200TL-FCG484I

MPF200TL-FCG484I

IC FPGA 244 I/O 484FBGA

Microchip Technology

2,093 341.38
MPF200TL-FCG484I

数据手册

PolarFire™ 484-BFBGA Tray Active Not Verified - 192000 13619200 244 - 0.97V ~ 1.08V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (19x19)
A42MX16-3TQG176I

A42MX16-3TQG176I

IC FPGA 140 I/O 176TQFP

Microchip Technology

2,232 302.03
A42MX16-3TQG176I

数据手册

MX 176-LQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 176-TQFP (24x24)
A54SX32A-2FG256I

A54SX32A-2FG256I

IC FPGA 203 I/O 256FBGA

Microchip Technology

4,405 303.30
A54SX32A-2FG256I

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
A54SX32A-2FGG256I

A54SX32A-2FGG256I

IC FPGA 203 I/O 256FBGA

Microchip Technology

2,850 303.30
A54SX32A-2FGG256I

数据手册

SX-A 256-BGA Tray Active Not Verified 2880 - - 203 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
AX250-2FG484

AX250-2FG484

IC FPGA 248 I/O 484FBGA

Microchip Technology

1,181 304.18
AX250-2FG484

数据手册

Axcelerator 484-BGA Tray Active Not Verified 4224 - 55296 248 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
AX250-2FGG484

AX250-2FGG484

IC FPGA 248 I/O 484FBGA

Microchip Technology

1,290 304.18
AX250-2FGG484

数据手册

Axcelerator 484-BGA Tray Active Not Verified 4224 - 55296 248 250000 1.425V ~ 1.575V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (23x23)
A3PE600L-FGG484M

A3PE600L-FGG484M

IC FPGA 270 I/O 484FBGA

Microchip Technology

4,051 304.45
A3PE600L-FGG484M

数据手册

ProASIC3EL 484-BGA Tray Active Not Verified - - 110592 270 600000 1.425V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A54SX72A-FFGG484

A54SX72A-FFGG484

IC FPGA 360 I/O 484FBGA

Microchip Technology

1,426 306.06
A54SX72A-FFGG484

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (27X27)
A54SX72A-FFG484

A54SX72A-FFG484

IC FPGA 360 I/O 484FBGA

Microchip Technology

1,976 306.06
A54SX72A-FFG484

数据手册

SX-A 484-BGA Tray Active Not Verified 6036 - - 360 108000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 484-FPBGA (27X27)
A54SX32A-2BG329

A54SX32A-2BG329

IC FPGA 249 I/O 329BGA

Microchip Technology

4,604 306.06
A54SX32A-2BG329

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)