产品中心

制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
A54SX32A-2BGG329

A54SX32A-2BGG329

IC FPGA 249 I/O 329BGA

Microchip Technology

4,092 306.06
A54SX32A-2BGG329

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 329-PBGA (31x31)
A54SX32A-1BGG329I

A54SX32A-1BGG329I

IC FPGA 249 I/O 329BGA

Microchip Technology

1,650 306.06
A54SX32A-1BGG329I

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 329-PBGA (31x31)
A54SX32A-1BG329I

A54SX32A-1BG329I

IC FPGA 249 I/O 329BGA

Microchip Technology

2,972 306.06
A54SX32A-1BG329I

数据手册

SX-A 329-BBGA Tray Active Not Verified 2880 - - 249 48000 2.25V ~ 5.25V Surface Mount -40°C ~ 85°C (TA) - - 329-PBGA (31x31)
A42MX16-3PQG208I

A42MX16-3PQG208I

IC FPGA 140 I/O 208QFP

Microchip Technology

1,455 304.90
A42MX16-3PQG208I

数据手册

MX 208-BFQFP Tray Active Not Verified - - - 140 24000 3V ~ 3.6V, 4.5V ~ 5.5V Surface Mount -40°C ~ 85°C (TA) - - 208-PQFP (28x28)
A3P1000-2FG484M

A3P1000-2FG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,147 309.35
A3P1000-2FG484M

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
A3P1000-2FGG484M

A3P1000-2FGG484M

IC FPGA 300 I/O 484FBGA

Microchip Technology

3,906 309.35
A3P1000-2FGG484M

数据手册

ProASIC3 484-BGA Tray Active Not Verified - - 147456 300 1000000 1.14V ~ 1.575V Surface Mount -55°C ~ 125°C (TJ) - - 484-FPBGA (23x23)
M2GL150T-1FCV484I

M2GL150T-1FCV484I

IC FPGA 248 I/O 484BGA

Microchip Technology

2,623 330.86
M2GL150T-1FCV484I

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-FBGA (19x19)
M2GL150T-1FCVG484I

M2GL150T-1FCVG484I

IC FPGA 248 I/O 484BGA

Microchip Technology

3,374 330.86
M2GL150T-1FCVG484I

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 484-BGA
M2GL150TS-1FCV484

M2GL150TS-1FCV484

IC FPGA 248 I/O 484BGA

Microchip Technology

4,001 330.86
M2GL150TS-1FCV484

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-FBGA (19x19)
M2GL150TS-1FCVG484

M2GL150TS-1FCVG484

IC FPGA 248 I/O 484BGA

Microchip Technology

4,884 330.86
M2GL150TS-1FCVG484

数据手册

IGLOO2 484-BFBGA Tray Active Not Verified - 146124 5120000 248 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 484-BGA