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制造商 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装

























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
图片 制造商型号 库存情况 价格 库存 数据手册 系列 封装/外壳 包装 产品状态 可编程 LABs/CLBs 数量 逻辑元件/单元数量 总 RAM 位数 I/O 数量 门数 电压 - 电源 安装类型 工作温度 等级 认证 供应商设备封装
M1AFS600-1FG484I

M1AFS600-1FG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

2,337 301.22
M1AFS600-1FG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
M1AFS600-1FGG484I

M1AFS600-1FGG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

3,550 301.22
M1AFS600-1FGG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
AFS600-1FG484I

AFS600-1FG484I

IC FPGA 172 I/O 484FBGA

Microchip Technology

1,740 301.22
AFS600-1FG484I

数据手册

Fusion® 484-BGA Tray Active Not Verified - - 110592 172 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 100°C (TJ) - - 484-FPBGA (23x23)
A42MX24-PQG160

A42MX24-PQG160

IC FPGA 125 I/O 160QFP

Microchip Technology

4,895 296.54
A42MX24-PQG160

数据手册

MX 160-BQFP Tray Active Not Verified - - - 125 36000 3V ~ 3.6V, 4.75V ~ 5.25V Surface Mount 0°C ~ 70°C (TA) - - 160-PQFP (28x28)
M2GL150-1FC1152

M2GL150-1FC1152

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

4,740 297.87
M2GL150-1FC1152

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2GL150-1FCG1152

M2GL150-1FCG1152

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

3,246 297.87
M2GL150-1FCG1152

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount 0°C ~ 85°C (TJ) - - 1152-FCBGA (35x35)
M2GL150-FC1152I

M2GL150-FC1152I

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

1,012 297.87
M2GL150-FC1152I

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
M2GL150-FCG1152I

M2GL150-FCG1152I

IC FPGA 574 I/O 1152FCBGA

Microchip Technology

2,323 297.87
M2GL150-FCG1152I

数据手册

IGLOO2 1152-BBGA, FCBGA Tray Active Not Verified - 146124 5120000 574 - 1.14V ~ 2.625V Surface Mount -40°C ~ 100°C (TJ) - - 1152-FCBGA (35x35)
M7AFS600-FG256I

M7AFS600-FG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

2,227 304.72

-

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)
M7AFS600-FGG256I

M7AFS600-FGG256I

IC FPGA 119 I/O 256FBGA

Microchip Technology

1,955 304.72

-

Fusion® 256-LBGA Tray Active Not Verified - - 110592 119 600000 1.425V ~ 1.575V Surface Mount -40°C ~ 85°C (TA) - - 256-FPBGA (17x17)